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Sputter coating, also known as physical vapor deposition (PVD), is a process used to deposit thin films of material onto a surface. The purpose of sputter coating is to create a thin film with specific properties, such as conductivity, reflectivity, or corrosion resistance.
Sputter coating involves the use of a vacuum chamber in which a target material is bombarded with high-energy ions, usually from an inert gas such as argon. The ions knock atoms from the target material, which then deposit onto a substrate, creating a thin film.
Sputter coating is used in a variety of applications, including the manufacturing of microelectronics, optical coatings, and surface engineering. For example, sputter coating can be used to deposit a thin layer of metal onto a plastic substrate to create an electromagnetic shield, or to deposit a thin layer of a transparent conductive material onto a glass substrate for use in touch screens or solar cells.
In summary, the purpose of sputter coating is to deposit a thin film of material onto a substrate with specific properties for use in a wide range of applications.
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